| | | Technical Services
| | | | | Strategic Services
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| | Tools
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| | About Ardent
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| Process and Reliability Assessments | |
Very small process changes during manufacture of MEMS and nanotechnology can lead to
order-of-magnitude shifts
in mechanical or
thermal stresses on components, directly affecting device performance
and reliability. The challenge for manufacturers of MEMS and
nanotechnology devices is to effectively deliver high performance
products in this
field where quality standards lag technical innovation.
- Process Audit Reviews: We can identify key quality control issues by reviewing existing protocols and qualifications
- Reliability Analysis: Root cause failures can be extremely
difficult to identify, particularly in devices
where surface effects dominate and contamination can be
an issue. Our technical experts
can prioritize potentially costly measures for assessing
and improving device reliability.
- Evaluation of surface chemistry and potential for
contamination to affect device performance.
- Adhesion and anti-adhesion performance is based on
surface and interface chemistry. Our
experts can work with your staff to develop protocols that institute quality procedures to
ensure reliability.
- Ingress and egress of
materials in various packaging designs. We review packaging design as it relates to service life
and reliability.
| | Reference Silicon Device | Silicon Device with Galvanic Corrosion |  |  |  |  |
| | Images courtesy of Prof. Conrad Stoldt of the University of Colorado, Boulder |
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